The main stages
First, engineers design the chip logic and the masks used for manufacturing. Billions of transistors are formed on a silicon wafer, after which individual dies are separated, tested and packaged.
The chips are then installed on a hashboard. Voltage regulators, controllers, memory, a control board, heatsinks and fans are added. A finished ASIC is tested for hashrate, consumption, stability and temperature.
- silicon wafer and process node
- die and packaging
- hashboard and power circuits
- heatsinks, fans and enclosure
- firmware, calibration and quality control
Why a newer process node does not guarantee a better miner
A smaller process node can increase transistor density and efficiency, but the real device also depends on architecture, frequency, voltage, cooling, the power supply and manufacturing quality.
That is why you should compare more than the chip name: look at J/TH or J/KSol, stable hashrate, warranty, price, noise and repair availability.
Real photos and source material
These photographs and diagrams are sourced from public archives. Open the source link to check the author and license.

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